| 发明名称 |
Lead frame for integrated circuit devices |
| 摘要 |
A lead frame for an IC device includes a body element located at its center, the body element including recesses in its outer periphery in which the inner tips of the leads of the lead frame are fitted at predetermined positions. With such an arrangement, the leads are prevented from being deformed during steps of formation of the IC device. |
| 申请公布号 |
US4415917(A) |
申请公布日期 |
1983.11.15 |
| 申请号 |
US19810293130 |
申请日期 |
1981.08.17 |
| 申请人 |
NIPPON ELECTRIC CO., LTD.;SUMITOMO METAL MINING COMPANY LIMITED |
发明人 |
CHIBA, HIROSHI;OGURA, SHOICHI |
| 分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L29/60;H01L23/48 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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