| 摘要 |
PURPOSE:To realize more reliable transfer of wafers between carrying system and carrier by keeping a distance between each groove of carrier and stage to the designed value. CONSTITUTION:In case of placing a carrier 6 on a stage 3, the carrier 6 is moved in the direction indicated by arrow A from behind the stage 3, the highest groove 6a and the lowest groove 6b of the carrier 6 are respectively engaged with the arm members 2, 2 of the upper and lower stages and moreover the carrier 6 is moved in the direction indicated by arrow A. Thereby, the carrier 6 is pressure-welded in contact with the stick member 1. The carrier is thus placed on the stage, positioning the groove inside the carrier and the stage. Then, the stage 3 is moved upward or downward by the elevator shaft 5 by the specified pitches and thereby the wafer can be transferred between the carrying belt 4 and carrier 6 arranged between a pair of stick members 1, 1. At this time, since the arm member 2 is fixed on the stage 3 through the stick member 1, distance between the grooves 6a, 6b engaged with the arm member 2 and stage 3 is always kept constant. |
