| 摘要 |
An assembly is provided for protectively supporting semiconductor wafers individually within a support while permitting processing of both faces of the wafer, as well as facilitating rapid insertion and removal of wafers into the support, and movement of wafers between processing stations. The assembly includes a plate-like support through which is defined an aperture of diameter larger than the wafer, and a plurality of clips mounted within the periphery of the aperture and the plane thereof and resiliently gripping edgewise a wafer inserted into the aperture and supporting same within the plane of the aperture. Each clip extends centrally inwardly of the aperture and terminates in an arcuate portion within which the edge of the wafer is retained, and defines a flat portion generally parallel to the aperture plane. The support assembly is advantageously positioned within a processing chamber, and the support plate preferably includes a plurality of apertures and associated clips, as well as being movable within the chamber to various processing stations. Extendable pins associated with the processing chamber are provided to depress the flat portion of the clips during wafer insertion and removal to obviate any possibility of abrasion. Simple automated equipment is usable to effect wafer insertion and removal, and a thin load lock of small volume is easily defined by sandwiching the support between suitable sealing members. |
