| 摘要 |
PURPOSE:To seal a case with a cap without effecting the thermal influence to an element by blowing gas which is heated to high temperature only to the bonded part of the case with the cap, thereby welding the soldering material to bond the both. CONSTITUTION:A case 5, a soldering material 6 and a cap 7 are assembled. Then, the end of a spray part 9 which is heated by a heater 8 is matched to the soldering material, and nitrogen is sprayed from the port to the soldering material. Nitrogen is heated by the heater while passing through the port, soldering material is molten by the heating nitrogen to bond the cap 7 to the case 5. In the sealing method described above, only the soldering material is heated. Accordingly, a semiconductor element is not heated to high temperature at the bonding time which was heretofore in problem, the variation in the characteristic at the bonding time and the occurrence of abnormal outer appearance can be effectively prevented. |
