<p>A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.</p>
申请公布号
WO2007143668(A2)
申请公布日期
2007.12.13
申请号
WO2007US70446
申请日期
2007.06.05
申请人
CORSAIR MEMORY;PAUL, ANDY;BEEKLEY, JOHN, S.;LIEBERMAN, DON;SOLVIN, DAN;PEARCE, ROBERT;MUELLER, MARTIN, E.
发明人
PAUL, ANDY;BEEKLEY, JOHN, S.;LIEBERMAN, DON;SOLVIN, DAN;PEARCE, ROBERT;MUELLER, MARTIN, E.
