发明名称 |
LEAD STRUCTURE FOR TAPE AUTOMATIC BONDING |
摘要 |
A lead frame (20) for tape automated bonding includes individual leads (12) each having a stretch loop (40) to accommodate elongation of the loop as the lead is bonded to a substrate (28) after inner lead bonds have been formed to an integrated circuit (26). Such a lead frame allows temporary connection and testing of the circuit prior to final lead formation and packaging. |
申请公布号 |
JPS58184752(A) |
申请公布日期 |
1983.10.28 |
申请号 |
JP19830058840 |
申请日期 |
1983.04.05 |
申请人 |
FAIRCHILD CAMERA & INSTRUMENT CORP |
发明人 |
UIRIAMU ESU FUII |
分类号 |
H01L21/60;H01L23/495;H05K1/02 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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