Power module, particularly power semiconductor module, has housing with multiple receiving elements and carrier element, where elastic deformable cover is arranged on carrier element

摘要

The power module (10) has a housing (21) with multiple receiving elements (32) and a carrier element (22). An elastic deformable cover (11) is arranged on the carrier element. The cover is deformed by the receiving elements and carrier element. A substrate (24) is attached at the housing, which carries a semiconductor chip (43). Multiple conductive lines (40) are provided, which are made of aluminum material or copper material. An independent claim is included for a method for mounting a power module.