WERKWIJZE VOOR HET VERBINDEN VAN METALEN DRADEN AAN GEMETALLISEERDE ZONES VAN EEN HALFGELEIDERELEMENT.

摘要

An automatic machine for ball bonding a lead wire to an expanded contact of a semiconductor device and stitch bonding the wire to a lead of the semiconductor package is described. The machine automatically aligns an X-Y table in predetermined relationship to the semiconductor device by means of an electro-optical system. A bonding needle mounted on the table is then moved in a predetermined manner to press the balled end of the wire against the expanded contact. Wire is then positively payed out as the bonding needle is moved to the lead where a stitch bond is performed. After the stitch bond, the needle is raised to pull out a length of wire, then the wire is clamped to break the wire near the stitch bond. The length of the wire protruding from the needle is then passed through a flame to form a new ball preparatory to a new cycle.