| 摘要 |
PURPOSE:To facilitate bonding by using a metallic cylindrical projecting electrode as a projecting one for flip chip bonding and coating the surface of a chip with insulating resin in the same height as the projecting electrode. CONSTITUTION:A source electrode 12, a gate electrode 13 and a drain electrode 14 are formed onto a semiconductor base body 11, and the cylindrical projecting electrodes 72-74 are formed through metal thick plating. The surface of the chip is coated with insulating resin 8, and solder materials 92-94 are placed. Accordingly, solder does not adhere on insulating resin 8, and the solder materials 92-94 can be set up only in the internal space of the cylindrical projecting electrodes 72-74. |
