| 摘要 |
PURPOSE:To obtain the correspondence of 1:1 among chips and measured data even after one wafer is cut to each chip, and to detect the change of characteristics easily by putting chip discriminating symbols through exposure at each chip prepared to one Si wafer. CONSTITUTION:The Si wafer 2 to which a plurality of the chips are formed is placed onto a movable stage 1, and a mask 3 with a pattern quintuple as large as the chips is disposed onto the wafer through a lens such as a one fifth reducing glass 4 at a regular interval. A triangular mirror 5 is fitted on one side on the mask 3, and a transmission type liquid-crystal display board 6 displaying predetermined number and an auxiliary lens 8 functioning as a return path for the triangular mirror and beams are arranged to the rear of the triangular mirror. Consequently, predetermined number of the display board 6 is imaged and exposed onto the wafer 2 together with the pattern of the mask 3. Accordingly, the position of the wafer 2 can be grasped even when the wafer is cut at each chip, and the characteristics of the chips are classified simply. |
