发明名称 |
LODDEPULVER |
摘要 |
The invention relates to a solder powder for connecting components made of aluminium or aluminium alloys by brazing, in particular a brazing powder for connecting heat exchanger components. The solder powder consists of powder particles on an aluminium-silicon base having a weight fraction of more than 12% by weight of silicon, wherein the powder particles have been produced by a rapid solidification and contain uniformly distributed silicon primary crystal precipitations in the eutectic aluminium-silicon alloy structure. Coating with such a solder powder leads to a uniform distribution of the silicon on the surface of the component coated with solder powder and thus to the same good soldering results. |
申请公布号 |
DK2830822(T3) |
申请公布日期 |
2016.08.22 |
申请号 |
DK20130716195T |
申请日期 |
2013.03.20 |
申请人 |
Erbslöh Aluminium GmbH |
发明人 |
Sucke, Norbert William;LÖCHTE, Lothar;Grzesik, Martin |
分类号 |
B23K35/28;B23K35/02;C22C21/02;C22C21/04 |
主分类号 |
B23K35/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|