RESIN COMPOSITION, HEAT-DISSIPATING MATERIAL, AND HEAT-DISSIPATING MEMBER

摘要

The present invention provides a resin composition including aluminum oxide (A) containing molybdenum having a size on the order of µm or less and a resin (B); and a resin molded body formed by molding the resin composition. Also, the present invention provides a heat-dissipating material containing the resin composition; and a heat-dissipating member containing the resin molded body. The heat-dissipating member of the present invention can be used for electronic parts such as electronic devices, electric devices, OA devices or for LED illumination.