发明名称 SEMICONDUCTOR PACKAGE
摘要 PURPOSE:To enable to readily position a cap without using a jig without erecting sidewisely a lead base by forming a ?-shaped punched and erected part at the lead frame at the outermost side of lead frames, punching and erecting the lead adjacent to the lead frame of the outermost side and forming a stopper at the end part. CONSTITUTION:A pair of leads are symmetrically formed. A sand base part 14 represents a sealing glass, which is molten in a furnace, cooled to be solidified, thereby integrally seating a base 12 and a cap 13. A pair of ?-shaped punched and erected parts 15 are formed at a lead frame 11. The parts 15 are limited at both ends of the recess of a rectangular shape. When the width and height of the parts 15 are suitably selected by considering the calculation of the thickness of the cap 13, the cap 13 is snugly engaged within the recess, thereby eliminating the use of any jig in positioning of the cap 13.
申请公布号 JPS58170045(A) 申请公布日期 1983.10.06
申请号 JP19820053092 申请日期 1982.03.31
申请人 FUJITSU KK 发明人 YAMAUCHI MAREHIDE
分类号 H01L23/04;H01L23/495;H01L23/50 主分类号 H01L23/04
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