| 摘要 |
PURPOSE:To obtain the small-sized IC module having a large amount of heat radiation per unit surface by a method wherein a cap is hermetically attached to the back side of an IC mounted substrate, and a cooling medium is sealed. CONSTITUTION:The circumference of the cap 3 of Kovar is soldered on the back side 2 of the substrate whereon an IC chip 1 is mounted, and the cooling medium 5 is sealed in a closed vacant space 4. The surface of heat radiation can be increased if the cap is formed in fin type. According to this constitution, the small-sized IC module having excellent heat radiating efficiency can be obtained. This IC module is suitable for a high density mounting. |
