Process for selectively cutting an electrical conductive layer by irradiation with an energy beam.

摘要

A method of cutting an electrical conductive layer (1) by irradiation with an energy beam (5) includes the step of depositing an energy beam film (3) on the portion of the electrical conductive layer (1) to be cut. The energy beam absorbing material (3) absorbs the energy beam more readily than the electrical conductive layer (1) and thus when the energy beam (5) is irradiated on to the surface the portion of the electrical conductive layer (1) beneath the film (3) melts due to the energy adsorbed by and transferred from the film (3).