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经营范围
发明名称
반도체용 금의 극세선(골드와이어 : gold Bonding wire) 제조방법
摘要
<p>내용 없음.</p>
申请公布号
KR830001996(B1)
申请公布日期
1983.10.04
申请号
KR19820001125
申请日期
1982.03.16
申请人
发明人
分类号
H01L23/00
主分类号
H01L23/00
代理机构
代理人
主权项
地址
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