| 摘要 |
PURPOSE:To enhance the accuracy of the bonding position at a frame electrode side by fixing a frame to a ceramic base only on the lower surface of the electrode when a low melting point glass is glazed on the base and a lead frame is secured to the glass to form a glass-sealed IC container, therby enabling the recognition of the pattern at the frame electrode side. CONSTITUTION:A recess is formed on the surface of a ceramic base 2, an adhesive layer 6 is formed in the recess, a low melting point glass layer 3 is coated on the base surface surrounding the recess, and a frame electrode 5 provided on the lead frame 4 is secured to the layer 3. Thus, only the lower surface of the electrode 5 to become the wire bonding region of the frame 4 is secured to the base 2 through the glass 3. In other words, the glass 3 is not glazed to the entire region which surrounds the recess 1, but formed only on the lower surface of the electrode 5. Accordingly, no displacement in the bonding is produced. |
