METHOD FOR THE HERMETIC ENCAPSULATION OF VERY HIGH FREQUENCY ELECTRONIC COMPONENTS COMPRISING THE MAKING OF METALLIC TRAVERSES, AND DEVICE MADE BY SUCH A METHOD

摘要

A process of construction of a device for hermetic sealing in a case comprising a sealed ceramic crossover formed by a metal conductor, without having recourse to the technology of cast alumina, which is delicate and costly, and without using sealing glass which is undesirable for very high frequencies. The process comprises the manufacture of molded parts by pressing green alumina to which binders have been added, so as to obtain a case bottom and a frame, which is metalized only after previous firing at 1000 DEG C., using the molybdenum-manganese deposit by silk-screen printing, then which is sintered at the normal temperature of alumina at 1500 DEG C.