| 摘要 |
PURPOSE:To aim at improvement in the operation efficiency of wire bonding, by detecting slackness and tension in a metallic fine-wire being fed out of a spool with both first and second switches, and controlling a main roller in rotation, in case of an assembling process for semiconductor units. CONSTITUTION:A spool 8 is attached to a spool holder 9 as well as to a main roller 2 via a magnet segment 10 while a coiled wire 5 is stretched over the specified route and held by a capillary 11. Next, the wire 5 is fed out by a delivery roller 4 interlocked with the main roller 2. At this time, if the wire 5 comes loose and pendent whereby touches a contact maker 7, the rotation of both rollers 2 and 4 comes to a stop. When wire runs out due to the wire bonding operation and the wire 5 is pulled upward, it touches a contact maker 6 and again rotates both rollers 2 and 4. Therefore, during the wire bonding process, breakdown trouble attributable to wire tension will not happen at all and operation efficiency is thus improved. |
