发明名称 ELECTRONIC PARTS AND MANUFACTURE THEREOF
摘要 PURPOSE:To obtain an electronic parts having large strength and the reliability of hermetically sealing by preventing a glass from producing remaining distortion when a pellet is interposed between a pair of lead ends of large-diameter parts and hermetically sealed and covering the thick part of the lead. CONSTITUTION:Holes 10 are opened at an equal interval at a supporting plate 9 of a metallic jig 8, lead wirings 11 are inserted into the holes, a glass tube 4 is fitted, and a pellet 3 and lead wirings 12 are inserted, thereby forming an interval m=0.1-0.5mm. between the thick end face of the wirings 12 and the upper end of the tube. The glass tube which is heated to approx. 670 deg.C in N2 is bonded at 14 to the thick part 1. The wirings 2 are not pulled off from the glass unit 5 and not isolated from the thick part 1. The glass unit is gradually cooled from the annealing point 430 deg.C of the glass unit to the distortion point of 380 deg.C, thereby preventing the glass unit from remaining the distortion. According to this configuration, an electronic part which has high reliability of hermetically sealing with high strength can be obtained.
申请公布号 JPS58158949(A) 申请公布日期 1983.09.21
申请号 JP19820040813 申请日期 1982.03.17
申请人 HITACHI SEISAKUSHO KK 发明人 KUWATANI SETSUO;MOROSHIMA HEIJI;TERAKADO HAJIME;YAMADA KOUHEI
分类号 H01L23/08;H01L23/051 主分类号 H01L23/08
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