| 摘要 |
PURPOSE:To reduce the manufacturing cost of an automatic wire bonding method by recognizing via a TV camera a mark formed of resistance paste to notify the position of an electrode indirectly on a substrate, and calculating the relative position with the electrode on an IC chip, thereby automatically wiring between the electrodes. CONSTITUTION:The position of an electrode on a thick film printed board and the relative position of a position detecting mark (resistance pattern) are accurately decided in advance, and stored. Accordingly, when a position detecting mark is recognized by a TV camera, the presence of the electrode on the board can be discriminated at the position of the prescribed distance from the mark as an origin. The relative position can be calculated by a computer on the basis of the memory. On the other hand, the electrode of IC side can be readily recognized by the camera since Au or Al is deposited at the periphery of the IC chip. Thus, the electrode on the chip and the position detecting mark made of the resistance pattern on the board can be read by the camera, thereby automatically wiring between the electrodes which are recognized at the relative position. The error of matching the mask at the time of forming the position detecting mark and the electrode on the board is slight, and not defective. |
