Cooling device for electrical components

摘要

The cooling device according to the invention contains a cooling body (1) having at least one closed cooling channel (1a) through which the cooling medium flows. A liquid cooling medium, whose boiling point is somewhat less than the cooling body temperature, is transported through the cooling body (1) by a circulating pump. The cooling medium vaporises in the cooling body (1) and is subsequently passed via a liquid separator (6), the separated liquid being supplied directly to the circulating pump again. The vapour component is compressed by a compressor (2) and is condensed in a condenser (3). The liquid cooling medium, which is thus produced again, is depressurised via a restrictor valve (4), and the remaining vapour components are supplied via a vapour separator (7) directly to the compressor (2) again. The liquid component of the cooling medium is transported into the cooling body (1) again, via the circulating pump (5). <IMAGE>