| 摘要 |
PURPOSE:To obtain a thin gold plating film having less pinholes and excellent corrosion resistance and oxidation resistance by interrupting the conduction of electricity for electroplating, applying strike plating of platinum group metals and again applying the electroplating in succession. CONSTITUTION:In a stage of forming a gold plating film on an underlying metallic material by electroplating, the period for forming the gold plating film is divided to plural times by interrupting the conduction of electricity to a plating bath one or twice, and strike plating of platinum group metals such as gold, palladium or the like is applied in said period when the conduction of electricity is interrupted. The plating bath contg. metallic ions to be plated in a concn. lower than the concn. thereof in ordinary plating baths is used for the above- mentioned strike plating, and the uniform plating is accomplished under the conditions of large current density, a short time and low current efficiency, whereby the pinholes of the gold plating film are decreased considerably and corrosion resistance, oxydation resistance, etc. are improved. |
