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发明名称
SEALING MOLD MATERIAL FOR INJECTION MOLDING OF ELASTIC FILLER LAYER
摘要
申请公布号
JPS58146603(A)
申请公布日期
1983.09.01
申请号
JP19820027973
申请日期
1982.02.22
申请人
NIPPON KOKUYU TETSUDO;RIYOUWA SANSHI KK;MITSUBISHI YUKA KK
发明人
TSUMENAGA TOORU;YOSHIDA HIROSHI;MATSUMURA HIROSHI;YOSHIMURA NAOKI;OKUYAMA HIRAKAZU
分类号
E01B1/00;E01B26/00;E01B37/00
主分类号
E01B1/00
代理机构
代理人
主权项
地址
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