Hermetically sealed package for optoelectronic semiconductor devices.

摘要

A hermetically sealed optoelectronic semiconductor device and package assembly comprises a metallic stud providing an electrical connection to one of the device electrodes, and a heat sink mounting block for the device mounted on and electrically connected to the stud. The device is mounted on the mounting block so that the optical axis of the device is aligned with the stud axis. The mounting block has a substantially annular bottom coaxial with the stud axis so that thermal stress generated between the stud and the mounting block will be substantially balanced and deviation of the optical axis of the device will be minimized. A gap can be provided in the annular bottom to accommodate an electrical lead to which the other of the device electrodes is connected. Alternatively, the annular bottom is continuous and the electrical lead passes through the central passage provided in the stud.