| 摘要 |
PURPOSE:In the production of lithium niobate single crystal elements, dicing is effected in the parallel direction with the crossing line of the cleavage plane of the single crystal with wafer surface to prevent the reduction in yield caused by cracking and breaking of single crystals. CONSTITUTION:Wafers are cut out so that the wafer surface of lithium niobate single crystal becomes (2ii0). At this time, the cleavage plane is (i012), (01i2) and (1i02) and the directions of crossing lines with the wafer surfaces are in X and Y which are at certain angles to the original flat surface 2. The wafer 1 is held at a certain position on the basis of the original flat surface 2 and dicing lines are formed as cutting grooves so that the lines become parallel with both X and Y. Then, the single crystal is cut to give single crystal elements of lithium niobate suitable for use as a filter for surface acoustic waves. |
