| 摘要 |
PURPOSE:To simplify the manufacturing process, and to reduce manufacturing cost largely by forming a gold plating layer to one part on a metallic thin-film as a bonding section. CONSTITUTION:A NiCr layer 2 is laminated onto an insulating substrate 1 made of silicon oxide (SiO2) or ceramics or the like through a vacuum deposition method or a sputtering method. The film thickness of NiCr differs according to the size of the electrode, but it is preferable that it is kept within a range of several hundreds or several thousands Angstrom . The NiCr film is etched to a desired shape through a photolithography method to form an NiCr layer 2. Sections except a section to be plated with Au is coated with a photo-resist (a photosensitive acid-resistant film), and the film surface of the NiCr layer of the section to be plated with Au is treated with an acidic cleaner such as Oxytron No.15 (a merchandise name). The film surface is washed away by wafer, treated with dilute hydrochloric acid, etc., and washed lastly by water once more, and the surface treating of the NiCr layer is completed. The surface is plated with Au through a normal method in a normal bath, and the desired Au plating layer 4 is formed. |
