| 摘要 |
PURPOSE:To reduce the malfunction due to alpha ray particles of a resin sealed type semiconductor devide, by setting the content of U and Th respectively less than the specific value. CONSTITUTION:A semiconductor chip is sealed by approx. 60-90wt% of crystalline or fused silica wherein the content of U and Th are respectively less than approx. 5ppb is mixed with the mold resin as the filler. Thereby, the failure rate based on the malfunction due to alpha corpuscular rays can be reduced to approx. 200fit without increasing the manufacturing process. It becomes difficult to generate stress by part wherein polyimide or Si resin is not used on the semiconductor chip, and accordingly a resin sealed type RAM can be formed without deteriorating the characteristic. |
