| 摘要 |
PURPOSE:To provide an inexpensive and high-reliable semiconductor pressure converter which eliminates welding between a thin thickness wall pipe and a thick thickness wall part, by brazing together a pressure-collecting body made of stainless steel and a sensor part body by the use of a Au-Sn brazing material. CONSTITUTION:After peripheral parts of connecting holes 9 and 10 are brazed together, an outer peripheral part of a joining surface is further welded, and a stainless steel pipe 14, measuring 2.0mm. in an outer diameter and 1.0mm. in an outer diameter, is located in the connecting holes 9 and 10 in the joining surface, they are joined together by a high frequency superheat using a ring 15, sizing 8mm. in an outer diameter, and 2mm. in an innerdiameter, made of an Su-16.8% Sa alloy foil with a thickness of 30mu. Further, since only brazing together of the peripheral parts of the connecting holes 9 and 10 does not enable the joined part to be sufficient in a strength, an outer periphery of a connecting surface between a sensor part body 2 and a pressure collecting part body 1 is welded by plasma (or may be welded by TIG or EBW) to unite them monolithically, and this improves strength. Even if they are connected together using a ring, in which Sn is vacuum-deposited 10mum thick on both surfaces of an Au foil with a thickness of 30mum, instead of the Au-Sn alloy foil ring 15, a similar result to the aboves can be obtained. The employment of the method sharply improves a joining strength, decreases a quantity of a brazing material used, and permits the reduction of a product cost. |
