| 摘要 |
PURPOSE:To realize automatic processing for almost all steps by combining the comb-shaped lead section and metal tape. CONSTITUTION:The recesses 2 are respectively provided at the specified areas of the lead sections 10, 11, 12. On the other hand, plurality of wires 5 in such a length as bridging over the lead sections by punching a metal tape 3 having good conductivity such as copper (Cu). This metal tape 3 is placed on a semiconductor chip 7 and it is fixed to the one end of wire. The metal tape 3 is placed on the recess of lead section and the semiconductor chip 7 is fixed to the recess of lead section 10, while the other ends of wire part are respectively fixed to the recesses of lead sections 11, 12. The semiconductor chip 7, wire part 5 and lead sections 10, 11, 12 are sealed by resin 8. The resin 8 is formed in such a thickness as almost equal to the lead section or recess and the one surface and the other surface of lead section are respectively exposed. Each mold type semiconductor element is obtained by cutting the tie bar part 9 of the lead section. |
