| 摘要 |
PURPOSE:To obtain a chip-shaped piezoelectric element which is capable of phase bonding, by connecting an exciting electrode formed on a single side of a piezoelectric oscillating unit which is laminated with an insulated plate to a lead-out electrode formed on the other side of a substrate via a metallic material. CONSTITUTION:A piezoelectric oscillating unit is formed by connecting an exciting electrode 102 formed on a single side of a piezoelectric substrate 101 and an exciting electrode 103 formed on the other side of the substrate 101 to the lead- out electrodes 104 and 105 which are formed on a diagonal line of the substrate 101 respectively. This piezoelectric unit is laminated with insulators 11 and 11. Conducting films 15a and 15c are formed at the corner parts of diagonal lines of insulators 11 and 11. These conducting films are brought into contact with the electrodes 104 and 105 respectively. These electrodes are held by a metallic clip 106 to connect the conducting films of the upper and lower insulators to each other. In such a way, a chip-shaped piezoelectric element which is capable of phase bonding for packing can be obtained. |
