Cooling device for integrated components

摘要

The cooling device for integrated power amplifiers in the dual-in-line housing comprises a central, U-shaped heat sink having cooling surfaces running parallel to the side surfaces of the central heat sink and joined to the heat sink by crosspieces. The cooling surfaces have lugs which are in contact with the zero-volt lead of the power amplifier in the installed state. The side surfaces of the central heat sink and the cooling surfaces jointly form a convection region with the outlet openings arranged above.