| 摘要 |
PURPOSE:To offer a semiconductor device of high yield and high reliability wherein the internal connection work is easy, and contacts of a chip with internal leads, bonding faults, etc. do not exist, by using a lead structure wherein the space between the chip and the internal lead is sufficiently provided. CONSTITUTION:The figure represents the upper face drawing (before cap sealing or mold sealing) which shows the relative arrangement of the chip and lead contained in a device package. The chip 12 is contained on the header of the package 11, and the space between the outer periphery of the package 11 and the outer periphery of the chip 12 extend over approximately the total length of a pair of parallel two sides of the chip 12 (in this case, two side along the longitudinal direction of the package) which are smaller than the other two sides, then the lead 13 constituted of the internal lead 13-1 and the external lead 13-2 is not arranged. In other words, this device is constituted by not having the lead 13 at the center of the package. |
