| 摘要 |
PURPOSE:To improve the yield of a lead bonding structure by forming a bent structure with external leads formed, thereby avoiding improper connection. CONSTITUTION:External leads 2 which extend outwardly from the vicinity of the upper end of a tape carrier 1 are aligned at a constant pitch in the vicinity of the upper end, bent upwardly, formed obliquely, all bent horizontally in the region B directly before a fanout region formed obliquely, bent downwardly at the linear part out of the fanout region, and a bonded part is formed. Since the bent part is bent at the position crossing perpendicularly the center line of the leads 2, the forming conditions becomes the same among all leads 2. Consequently, the bonded surfaces of the leads 2 are all arranged generally on the same plane. When the variations in the levels of the outer leads are suppressed in this manner, no improper connection occurs even in the bonding structure using, for example, a reflow soldering method, thereby improving the reliability and yield. |
