发明名称 PREPARATION OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To form two kinds of Schottky barrier diodes on a single chip by forming a second insulating film in different dimensions at a pair of apertures provided on a first insulating film and thereby forming a barrier metal pattern. CONSTITUTION:A pair of apertures 31, 32 are provided on an insulating film 2 formed on a substrate 1. Then, after a metal silicide layer 4 is formed on the surface region of substrate 1 exposed from said apertures, a second insulating film 5 is formed on the entire part. Then, the insulating film 5 which is larger than the first aperture 31 and that which is smaller than the second aperture 32 are respectively etched from these areas and thereby an aperture 6 is provided. A barrier metal pattern 7 is formed and thereby two kinds of Schottky barrier diodes are formed.
申请公布号 JPS58132963(A) 申请公布日期 1983.08.08
申请号 JP19820014672 申请日期 1982.02.01
申请人 TOKYO SHIBAURA DENKI KK 发明人 SHINADA KAZUYOSHI
分类号 H01L27/06;H01L21/033;H01L21/331;H01L21/8222;H01L29/73 主分类号 H01L27/06
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