| 摘要 |
PURPOSE:To obtain a high quality image free from defects such as cracks by developing a photosensitive material consisting of a specified polyimide precursor, a specified bisazide sensitizer and a specified amine compound with a specified mixed solvent after exposure to ultraviolet rays and by carring out heat treatment. CONSTITUTION:A photosensitive resin composition consisting of 100pts.wt. polyimide precursor (a) having essentially repeating units represented by formula I(where R<1> is a ter- or quatervalent org. group contg. an aromatic ring such as phenylene or a heterocyclic ring, R<2> is a vivalent org. group contg. an aromatic ring or a group represented by formula III, M is H or NH4, and n is 1 or 2), 0.1-100pts.wt. bisazide compound (b) represented by formula II (where R<3> is a bi- or tervalent org. group), 1-400pts.wt. amine compound (c) having a group contg. H bonded to tertiary or secondary carbon or an unsatd. bond in the mollecule, and a solvent is applied to a substrate, dried by heating, imagewise exposed to ultraviolet rays, developed with a mixed solvent consisting of 50- 90wt% nonpolar solvent and 10-50wt% water, and heat treated at 150-500 deg.C. Thus, a fine image free from defects such as cracks for an integrated circuit, etc. is obtd. |
