发明名称 Multiple use component spacer and methods for preparing a spacer for mounting on and affixing a spacer to a circuit board
摘要 A multiple use component spacer having a component platform defining an aperture, having a plurality of lead grasping portions each having forked resilient portions defining a lead receiving slot for firm engagement with the leads of a range of packages without requiring the use of adhesives, having a plurality of lead abutment portions on its circumference, and having a plurality of feet on at least one surface.
申请公布号 US4395585(A) 申请公布日期 1983.07.26
申请号 US19810322969 申请日期 1981.11.19
申请人 MOTOROLA INC. 发明人 POLCYN, ERWIN R.
分类号 H05K3/30;H05K3/34;(IPC1-7):H05K7/08 主分类号 H05K3/30
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