发明名称 AUTOMATIC DIE BONDING DEVICE FOR SEMICONDUCTOR LASER CHIP
摘要 PURPOSE:To position the semiconductor laser chip at high speed with high accuracy by a method wherein light beams are irradiated onto the side surface of the semiconductor laser chip, the direction of reflected light is detected and the angle of rotation of a collet is controlled by a servomechanism. CONSTITUTION:Light beams emitted from a laser 9 are irradiated onto the side surface of the semiconductor laser chip 7 adsorbed to the collet 4. The distribution of luminous flux is equalized previously by passing light beams through a slit 11. Reflected light is passed through the slit 11 and received by a photodiode, and output is amplified by a preamplifier 14, and supplied to a servo amplifier 16 through a timing switch 15. Output is further amplified by the amplifier 16, a servomotor 17 is driven and the collet 4 is operated. The photodiode is constituted by combining left and right reversible ones while making the center to be a boundary. Accordingly, the angle of the chip 7 is controlled so that reflected light reaches the center of the photodiode, and die bonding is prepared.
申请公布号 JPS58123787(A) 申请公布日期 1983.07.23
申请号 JP19820005699 申请日期 1982.01.18
申请人 FUJITSU KK 发明人 IMAI HAJIME
分类号 H01L21/52;H01S5/00;H01S5/022 主分类号 H01L21/52
代理机构 代理人
主权项
地址