| 摘要 |
<p>PURPOSE:To enhance integration density and to improve heat-radiating capability by a method wherein a lead on a substrate rear surface is connected with an external lead penetrating the substrate before they are resin-sealed together with the substrate. CONSTITUTION:Provided on the rear side of a substrate 1 is a resin-sealed heavy duty semiconductor device 6 with a lead 7 leading out to be directly connected to an external lead 5. The lead 5 penetrates the substrate 1 via an opening and is fixed with solder. A junction-protecting resin coating is applied to the front surface of the substrate 1. The entirety is accommodated in a resin case 8 full of liquid epoxy resin 9. Heat treatment is performed for the setting of the epoxy resin 9.</p> |
