| 摘要 |
PURPOSE:To improve the external appearance shape of a lead frame for a semiconductor device by sealing the lead frame with resin, then forming a notch which reduces the thickness at the region to be cut, and removing a defect due to ''a burr'' in case of bonding. CONSTITUTION:Drawings show the region to be cut to form the end of a lead 4a, and a groove 9 having a triangular section in the main surface of back side to the cutting blade of upper die and a depth of approx. 1/3 of the thickness of a lead frame is opened. Accordingly, to cut with cutting blades 7a, 7b of upper and lower dies, the center of the groove is disposed on the blade 7a of the lower die, and the blade 7a of the upper die is hydraulically moved downwardly, thereby cutting. Even if a burr 8' which is produced by the ordinary cutting is produced, this burr can be contained in part of the groove 9. |
