| 摘要 |
PURPOSE:To enable accurate detection of the location of possible solder bridges or the like by providing a conductive rubber plate covering electrodes arranged on a detection substrate corresponding to soldered parts one to one. CONSTITUTION:A through hole 10 is formed on a detection substrate corresponding to soldered parts 6 of electronic components 2 and 3 on a printed circuit board 1. Conductive lands 11 are formed above and below the through hole 10. on the other hand, an anisotropically conductive rubber plate 14 is piled on the detection substrate 8 and as a solder bridge develops, an electrically closed circuit is formed to let current flow, enabling the detection of solder bridges or the like with an extremely simple contruction. Adequate elasticity of the conductive rubber 14 absorbs difference in the height of the soldered parts 6 thereby eliminating disinspection due to disable contact. |
