| 摘要 |
PURPOSE:To enable accurate detection of location of possible solder bridges or the like by pressing a detection substrate on the soldered parts through a conductive rubber plate to retain accurate conduction therewith as provided covering electrodes arranged on a detection substrate coresponding to the soldered parts one to one. CONSTITUTION:A through hole 10 is formed on a detection substrate 8 corresponding to soldered parts 6 of electronic components 2 and 3 on a printed circuit board 1. Conductive lands 11 are formed above and below the through hole 10. A circuit having a power source E and an ammeter A connected thereto is formed at the position corresponding to the solders 6 to be detected from these lands 11 through leads wires 12 and 13. On the other hand, an anisotropically conductive rubber plate 14 is piled on the detection substrate 8 and as a solder bridge 17, develops an electrically closed circuit is formed and current flows to enable the detection of the solder bridge. Adequate elasticity of the conductive rubber 14 allows through absorption of any difference in the height of the soldered section 6 eliminating misdetection due to a disabled contact. |
