发明名称 WAFER DICING BASE AND METHOD THEREOF
摘要 <p>PURPOSE:To easily obtain a pellet and prevent adhesion of foreign matter and missing of pellet by providing cutting groove wider than the line width corresponding to the dicing line and by also providing vacuum absorbing holes between grooves. CONSTITUTION:A cutting groove 4a wider than the dicing width 1b is provided on the surface of a base 4 and vacuum absorbing holes 4b corresponding to pellet 1a are provided respectively between grooves 4a. According to this structure, when the base is cut along the grooves, pellets can be obtained only by cancelling the vacuum condition after the cutting and adhered foreign matter and missing at the time of pellet separation can be prevented since a tape is not used.</p>
申请公布号 JPS58122748(A) 申请公布日期 1983.07.21
申请号 JP19820005068 申请日期 1982.01.18
申请人 HITACHI SEISAKUSHO KK 发明人 MIYATA KIYOYUKI;IWATA YOSHIO;KADOWAKI MASAHIKO;AUCHI MAKOTO
分类号 H01L21/301;H01L21/302 主分类号 H01L21/301
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