| 摘要 |
<p>PURPOSE:To enable to melt solder paste and to bond clip terminals in large quantity to an insulating substrate by employing a low cost clip terminal and a reflow furnace by mounting as an external terminal the clip terminals on the substrate having external terminal connecting electrodes, then screen printing solder paste on the electrode on the substrate, melting the paste and then bonding the clip terminals to the substrate. CONSTITUTION:A thin film resistor 12, a thin film condenser 13 and an external terminal connecting electrode 14 are formed on an insulating substrate, e.g., a ceramic substrate 11, thereby forming a hybrid integrated circuit substrate, and a connector-shaped clip terminal 15 is mounted on the substrate. Then, solder paste 16 is printed by a screen printing method on the electrode 14, on which the terminal 15 is mounted. Thereafter, this structure is passed through a reflow furnace at 210-250 deg.C, thereby melting the paste 16 and bonding the clip terminal 15 on the electrode 14 on the substrate 11.</p> |
