| 摘要 |
A power semiconductor component for boiling cooling or liquid cooling includes a semiconductor crystal disc having two main electrodes and, optionally, one or more control electrodes. The disc is built into a liquid and gas-tight housing through which an electrically insulating coolant can flow. The housing is formed substantially of a ceramic sleeve with metallic covers which are disposed on both sides and the metallic covers are directly acted upon by the coolant. Electric circuitry, especially resistors and diodes, are integrated in a circuitry module which is in force-locking thermal contact with the metallic cover of the power semiconductor component. |
