Laser processing apparatus

摘要

Disclosed is a laser processing apparatus, which includes a falling waveform control circuit for controlling the falling of discharge current waveform. A direct current power supply circuit is connected to a main discharge circuit and the falling waveform control circuit for supplying discharge current to these circuits. The main control circuit causes the discharge of the main discharge circuit and falling waveform control circuit successively. The discharge of the main discharge circuit is provided so that it is stopped when the discharge of the falling waveform control circuit is started. The discharge of the falling waveform control circuit is stopped by a discharge current stopping circuit. The main discharge circuit and falling waveform control circuit are connected to a laser beam oscillating section. The laser beam oscillating section irradiates the workpiece with laser beam according to the main discharge current and discharge current having controlled falling waveform supplied from both the aforementioned circuits.