| 摘要 |
PURPOSE:To form uniform plating layers even when there is a time between sticking of catalysts and electroless plating in the stage of forming conductive layers on insulation substrates by elecroless plating by sticking the plating catalysts on the substrates then heat treating the substrates and applying electroless plating thereon. CONSTITUTION:In the stage of forming conductive layers of circuit patterns on insulating substrates by an electroless plating method, first the substrates are treated with solns. contg. Sn and Pd compds. in order to form plating catalysts along circuit patterns, whereby the plating catalysts of metallic Pd are formed on the circuit patterns. Thereafter, the substrates are dipped in electroless plating solns. of Cu, Ni, etc., whereby plating layers of Cu and Ni are formed. If there is a considerable time between the stage for sticking the plating catalysts and the stage for electroless plating, the substrates are heated to >=80-90 deg.C after sticking of the plating catalysts to reactivate the activity of the plating catalysts degraded with time; thereafter, the substrates are subjected to the electroless plating to allow the plating metal to deposit uniformly. |
