| 摘要 |
<p>PURPOSE:To obtain the highly reliable resin sealed type semiconductor device by a method wherein the sealing is preformed using an epoxy resin composition having an excellent dampproof property and high-temperature electric characteristics. CONSTITUTION:The secimconductor device is sealed by the hardening material of epoxy resin composition having the essential components of novolac type phenol resin of 170-300 epoxy equivalent (a), novolac type phenol resin (b), and organic phosphine of cyano group and/or nitro group (c). The epoxy resin to be used is the novolac type epoxy resin of 170-300 epoxy equivalent such as, for example, phenol novolac type epoxy resin, cresol novolac type epoxy resin, phenol halogenide novolac type epoxy resin and the like. Pertaining to the ratio of mixture of the epoxy resin and a hardener, they are mixed in such a manner that the ratio of the number of phenolic hydroxyl radical of novolac type phenol resin and the number of epoxy radical of the epoxy resin will be in the ragne of 0.5-1.5.</p> |
