| 摘要 |
PURPOSE:To unify a material solution, and to form epitaxial growth layers having uniform composition and thickness by a method wherein a cover is transferred prior to make the material solution and semiconductor substrates to come in contact mutually, and a protruding part provided on the cover is made to stir the material solution. CONSTITUTION:Sliders 2, 21, 22 are laminated on a base 1 as to make penetraing holes 4 to coincide mutually. At the concave parts 3 of the other sliders 21, 22 excluding the slider 2, the semiconductor substrates 5 are accommodated, and the cover 7 is put on the slider 2 on the uppermost stage. After the temperature is risen up to the prescribed temperature, by making the cover 7 to transfer in the right and left direction by 5 times or more, the protruding part 71 transfers in the material solution 6 stir, and uniform composition is formed. After then, the sliders 2, 21 of the odd-numbered order from the upper part are transferred, and after the solution 6 is made to come in contact with the substrates 5, by cooling the substrates, the epitaxial growth layers are formed on the substrates 5. |
