SEMICONDUCTOR DEVICE COMPRISING A BONDING PAD

摘要

A semiconductor device, wherein an alloy wire (33) is mounted on the surface of a semiconductor substrate (31) carrying semiconductor element with a first densely formed electric insulation layer (32) interposed between said alloy wire and semiconductor substrate surface; after forming a second insulation layer (34) in the prescribed positions, a pure aluminium electrode (35) is deposited, one part of which is connected to said alloy wire (33) and the other part of which is attached to said first densely formed electric insulation layer (32), thereby constituting a wire bonding pad; and finally heat treatment is carried out to effect an ohmic contact between the aluminium electrode (35) and the alloy wire (33).